TAIPEI (Taiwan News) – Foxconn Technology Group is involved in talks to open a chip packaging and testing plant in Europe, reports said Wednesday (Sept. 4).

At the opening of SEMICON Taiwan, Foxconn Chair Young Liu (劉揚偉) discussed his company’s plans with reporters, per CNA. He said Foxconn was interested in expanding its advanced chip packaging and testing activities, the third phase in the semiconductor process after design and manufacturing.

Talks are proceeding about setting up a factory in Europe, though he did not reveal in which country the plant might be built. It is impossible to just produce chips in Europe, without doing any packaging and testing, Liu said.

A Foxconn packager and tester in the Chinese province of Shandong focuses on chiplets, small chips with a well-defined function which need to be interconnected. As to Foxconn’s other chipmaking activities, in addition to producing semiconductors for the car industry, it also plans to make chips for satellites.