TAIPEI (Taiwan News) — National Science and Technology Council (NSTC) Minister Wu Cheng-wen (吳誠文) said China's chip technology is at least 10 years behind Taiwan.
A Nikkei Asia report released in August cited a semiconductor research company as claiming that China's chip capabilities are only three years behind Taiwan's. During a session of the Legislative Yuan's Education and Culture Committee, Wu said the gap is substantially greater, per CNA.
Democratic Progressive Party (DPP) Legislator Wu Pei-yi (吳沛憶) said a semiconductor research firm found, after dismantling a Huawei phone, that China's chip technology has greatly improved, now trailing TSMC by only three years and asked if this is accurate. Wu responded, "I actually have my doubts (over the report)," and said the gap should be over 10 years, particularly since TSMC’s advanced process will soon reach 2nm.
According to information released in a previous TSMC earnings report, the 2nm advanced process is proceeding as planned or even exceeding expectations in terms of yield performances and is scheduled for mass production in 2025.
In China, there have been reports of significant expansion in production for the 28nm and more mature processes. According to data from TrendForce, it is estimated that by 2027, China's capacity in mature processes will account for 39% of global production.
In addition, the Chinese Ministry of Industry and Information Technology released a guidance catalog for the promotion and application of major technical equipment, including a deep ultraviolet lithography machine being interpreted as a significant technological breakthrough, possibly allowing the production of 8nm and smaller chips, per TrendForce.
According to a report by Deutsche Welle, Shanghai Microelectronics has applied for a series of EUV-related patents with China’s National Intellectual Property Administration, and market predictions suggest they may have mastered the key capability to manufacture chips at 7nm and below.
