TAIPEI (Taiwan News) — Power Semiconductor Manufacturing Company (PSMC) Chair Frank Huang (黃崇仁) said Tuesday (Oct. 22) the company has invested NT$2 billion (US$62.3 million) in its Tongluo plant to launch 3D AI foundry services.

At an investor conference held on Tuesday, Huang said PSMC will collaborate with AP Memory to develop foundry services that use multi-layer wafer stacking and high-capacity interposer technology, per the press release. He said Tongluo plant is expected to ramp up in the second half of 2025, with a planned capital expenditure of NT$10 billion based on demand.

Huang also said the company plans to collaborate with AMD and major logic foundries to develop next-gen AI computing solutions.

AP Memory Chair Chen Wen-liang (陳文良) said AI computing power is directly proportional to memory bandwidth, and computing and memory energy consumption are closely related. The mainstream 2.5D technology faces bandwidth and energy consumption bottlenecks.

PSMC's 3D AI Foundry technology breaks these 2.5D limitations, achieving more than 10 times the bandwidth and reducing bit unit power consumption by over 90%, Chen added.

The company said the percentage of panel driver IC products decreased from 21% in Q2 to 14% in Q3, while power management chips increased from 11% in Q2 to 14% in Q3, per CNA. DRAM and flash foundry services accounted for 42%.