TAIPEI (Taiwan News) — The first Taiwan-Europe Chip Innovation Forum (TECIF) held in Prague concluded on Thursday (Oct. 31), attracting over 200 participants from the industry, government, and academia.

Cohosted by the Taiwan Semiconductor Research Institute (TSRI) and Belgium’s Interuniversity Microelectronics Center (IMEC), the three-day event included representatives from Taiwan Semiconductor Manufacturing Company (TSMC) and Siemens, per CNA. The forum covered integrated circuit (IC) design and served as a platform for collaboration.

At the opening ceremony on Tuesday (Oct. 29), TSRI Director General Hou Tuo-hung (侯拓宏) said the forum would explore the latest strategies and breakthroughs in IC design and cooperation between Taiwan and Europe. “By combining Taiwan's cutting-edge technology with Europe’s expertise in academia and industry, we will create significant opportunities for the Taiwan-European semiconductor ecosystem,” he said.

Deputy Minister of Science, Research, and Innovation of the Czech Republic Jana Havlikova said, “We are starting now, though a bit late, but not too late.” Chips are a crucial cornerstone of digital energy products and will play a significant role in the global economy in the next decade, she said.

Havlikova added the forum’s discussions and workshops focused on developing strategies and exchanges aiming to drive technological innovation, promote international cooperation, and inspire new ideas.