TAIPEI (Taiwan News) — Memory and logic chipmaker Winbond Electronics joined the newly created SEMI Silicon Photonics Industry Alliance on Wednesday.
Winbond said it sees silicon photonics being used for AI applications in the future, and it hopes for joint research and development opportunities with the alliance’s other members, per CNA. The alliance was formed by SEMI under the leadership of TSMC in September last year with 30 members and has added more than 50 others since.
Windbond joined the alliance days after TSMC and Nvidia announced they would collaborate to develop silicon photonics. The technology has been touted as a way to create semiconductors that use less power and generate less heat than regular electronic circuits.
Windbond manufactures semiconductors in Taichung and Kaohsiung and has operations elsewhere in Asia, the US, and Europe, according to its website. It produces memory and logic chips for the communications, consumer electronics, and automotive markets.