TAIPEI (Taiwan News) — E Ink announced Wednesday its partnership with Realtek to launch a low-power electronic shelf label design.

E Ink said that the new design reduces thin-film transistor size by nearly 30% and flexible printed circuit board (FPC) by 50%, enabling partners to develop sleek labels, per CNA. FPCs can be twisted without damage while reducing weight and manufacturing costs.

The company explained that system-on-panel (SoP) technology embeds circuits directly into the glass or flexible substrate of e-paper displays, combining the integrated circuit (IC) and panel to create a unified system.

The technology significantly reduces material usage and product size while streamlining manufacturing processes, resulting in a more efficient and environmentally friendly display solution, per UDN.

Furthermore, the second-generation SoP design incorporates Realtek’s Bluetooth chipset using chip-on-glass packaging, creating the world’s first device to embed a radio frequency IC directly into glass, CNA reported.

E ink said since debuting its first SoP concept product for e-paper displays last year, it is committed to innovation. E Ink Chair Li Cheng-hao (李政昊) said that e-paper labels are replacing paper ones and offer businesses greater efficiency at lower energy consumption.