TAIPEI (Taiwan News) — Manz Asia opened Monday a semiconductor R&D center in Taoyuan to develop advanced panel-level packaging technology.

Manz CEO Lin Chun-sheng (林峻生) at a press event said the company is promoting chip-on-panel-on-substrate (CoPoS) technology to meet advanced packaging needs, per CNA. The technology allows chip assembly to take place on large panels instead of conventional wafers.

Furthermore, the new center is equipped to develop redistribution layer (RDL) tools for prototyping and mass production.

Lin said advanced semiconductor packaging now accounts for half of Manz Asia’s business. The company is investing in this field to support demand from global chipmakers, he added.

He confirmed that Manz Asia will complete its acquisition from Germany’s Manz AG in Q2. This move will make Manz Asia a fully Taiwan-owned and independently operated company.

To expand its global reach, the company has established operations in Malaysia for a European integrated device manufacturer. It has also entered Japan and India through recent partnerships and acquisitions.

Manz Asia specializes in precision wet processing, electroplating, and automation equipment for semiconductors. It has also expanded into the printed circuit board and display sectors.

The company has made several technology milestones in recent years. These include delivering a 600x600 mm fan-out panel-level packaging (FOPLP) line in 2019 and a 510x515mm through glass via etching tool for glass substrates last year.