TAIPEI (Taiwan News) — TSMC unveiled its next-generation System-on-Wafer-X (SoW-X) technology on Thursday, with mass production set for 2027.

The world’s largest contract manufacturer said in a press release that SoW-X, built on its advanced Chip-on-Wafer-on-Substrate (CoWoS) platform, will deliver up to 40 times the computing power of current solutions, marking a major leap for system-on-wafer designs.

The chipmaker added that it plans to bring 9.5 reticle size CoWoS to volume production in 2027, per CNA. This will enable the integration of 12 or more high-bandwidth memory stacks into a single package, addressing the surging AI demand.

TSMC is also developing supporting technologies, such as silicon photonics integration and compact optical engines, to enhance logic performance and energy efficiency. New integrated voltage regulators for AI applications are expected to provide five times the vertical power density of traditional solutions.

In addition to logic and packaging advances, TSMC announced new radio frequency and automotive technologies. Its N4C RF process will support WiFi 8 and advanced AI features for next-generation wireless devices, with pilot production set for early 2026.

TSMC’s N3A process is nearing the final stages of automotive-grade validation, while the company continues to refine its N4e process to meet the energy efficiency needs for edge AI applications.