TAIPEI (Taiwan News) — Foxconn revealed Wednesday its first-ever move into the African market via an acquisition through its subsidiary FIT Hon Teng.

Speaking at a Computex forum on Wednesday, Foxconn Spokesperson James Wu (巫俊毅) said the move reflects the group’s aim to match clients’ global need for speed and cost but did not disclose more info, per CNA.

Wu explained that Foxconn’s semiconductor strategy centers on applications, not capacity, with a focus on integrated design and packaging and testing. He pointed to a recent joint venture with France’s Thales and Radiall to enter the outsourced semiconductor assembly and test market (OSAT).

Foxconn’s collaboration with India’s HCL Group has received government approval to build a packaging and testing facility, Wu added. The Indian plant will emphasize software-linked applications, in line with Foxconn’s broader shift toward integrated AI and semiconductor solutions.

Wu projected strong momentum for Foxconn’s AI business, calling 2025 the “first year of AI.” In Q1, cloud and networking products made up 34% of sales, with AI servers comprising over half of all server shipments.

He also detailed how the company is developing AI-powered factories, starting with physical parameter modeling and digital twin simulations. These models are used to test and optimize productivity before real-world deployment.

Wu said the long-term goal is a self-reinforcing cycle where AI builds AI and robots build robots, pushing automation and productivity to new heights.